Microperforated mounting plate for Spacial CRN, S3D, S3X, PLM. For enclosures H is500 x W is500 mm. With holes diam 3,6mm on 12,5mm pitch. Multi-purpose mounting access. Step slide mounting location or direct fixing on backstuds (M8 screws). 90 Kg permissible load. Galvanised steel.
Microperforated mounting plate H500xW500 w/holes diam 3,6mm on 12,5mm pitch
Microperforated mounting plate H500xW500 w/holes diam 3,6mm on 12,5mm pitch
Related products
Modular box PC, Harmony iPC, HMIBM Performance DC Base unit 8 GB 4 slots
Modular box PC, Harmony iPC, HMIBM Performance DC Base unit 8 GB 4 slots
communication module Profibus DP V1, Altivar, 12Mbps, 1 female SUB D9 connector
communication module Profibus DP V1, Altivar, 12Mbps, 1 female SUB D9 connector
discrete output module Modicon Quantum – 32 O – positive logic (source)
discrete output module Modicon Quantum - 32 O - positive logic (source)
TeSys Deca thermal overload relays – 23…32 A – class 10A
TeSys Deca thermal overload relays - 23...32 A - class 10A
Disconnect Switch, TeSys LK4 Non fusible, 50hp at 600VAC, 3 pole, max 100A rated, plate mount
Disconnect Switch, TeSys LK4 Non fusible, 50hp at 600VAC, 3 pole, max 100A rated, plate mount
Inductive proximity sensors XS, inductive sensor XS6 M30, L74mm, brass, Sn22mm, 24…240VAC/DC, 1/2″
Inductive proximity sensors XS, inductive sensor XS6 M30, L74mm, brass, Sn22mm, 24...240VAC/DC, 1/2"
Vacuum switch 9016G – adjustable scale – 2 thresholds – Set 0 to 23.8 InHg
Vacuum switch 9016G - adjustable scale - 2 thresholds - Set 0 to 23.8 InHg
Melting Alloy Thermal Unit Class 30
Melting Alloy Thermal Unit Class 30
Reviews
There are no reviews yet.